SINGAPORE
24 June 2018
Customer Information
Name
Company Name
Title
Phone Number
Email Address
Quote Your Board
Quantity
Board Dimemsion
x
inches
mm
mils
Number of Layers
Board Thickness
inches
mm
mils
Material Type
FR4
High-Temp FR4
BT Resin
Polyimide
GETEK
Other Materials
(please specify)
Inner Copper Thickness
oz.
Outer Copper Thickness
oz.
Smallest Hole Size
inches
mm
mils
Minimum Trace Width
inches
mm
mils
Maximum Trace Spacing
inches
mm
mils
Soldermask
None
Single
Double
Colour
Green
Red
Yellow
Blue
Black
Silkscreen
None
Single
Double
Colour
White
Green
Red
Yellow
Blue
Black
Surface Finish
Copper
Hot Air Solder Level (HASL)
Organic Solderability Preservative (OSP)
Electroless Nickel Immersion Gold (ENIG)
Electrolytic Nickel
Electrolytic Hard Gold
Selective Gold
Yes
No
If yes,
micro
inches
Gold Finger
Yes
No
If yes,
micro
inches
Impedance Control
Yes
No
If yes,
Ohms, +/-
%
Blind or Buried Via
Yes
No
Via Plugging
None
Soldermask Tenting
Soldermask Plugging
Epoxy Plugging
V-Scoring
Yes
No
I
f yes, Number of V-Scoring
Slots/Cutouts
None
Slots
Cutouts
Slots & Cutouts
Electrical Testing
Yes
No
Quick Turnaround
Yes
No
Additional Information
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