The cost of the boards may vary depending on the complexity of the design, the number of layers, etc. The cost of Organic Solderability Preservatives (OSP) will be similar to that of Hot-Air Solder Levelling (HASL). The cost of Electroless Nickel Immersion Gold (ENIG) will be higher than OSP.
The Lead-Free compliance boards will have the same fabrication capabilities as the non Lead-Free boards.
Materials | Concentration Level | |
FR4 (High Temp) | Tg 170°C, Td 260°C CTE z-axis 140ppm/°C (Ambient - 288°C) | Dk=4.29@1 GHz Df=0.014@1 GHz |
BT/EPOXY | Tg 185°C, Td 260°C CAF Resistance CTE z-axis 140ppm/°C (Ambient - 288°C) | Dk=3.9@1 GHz Df=0.009@1 GHz |
Polyimide | Tg 260°C, Td 288°C CTE z-axis 55ppm/°C (Ambient - 288°C) | Dk=4.2@1 GHz Df=0.0141 GHz |
The process time for the boards may vary depending on the complexity of the design, the number of layers, the type of finish, etc.
We will provide support to small quantity prototype orders that are Lead-Free compliance.
A Certificate of Conformance (COC) will be given to state our product meets RoHS requirements.
Gold is plated by means of chemical deposition in ENIG process while electric current is used in Electrolytic Hard Gold process. The gold thickness of ENIG is limited between 2-6 micro inches.
Final Finish | Shelf Life |
Organic Solderability Preservatives (OSP) | 6 Months |
Electroless Nickel Immersion Gold (ENIG) | 12 Months |
Electrolytic Hard Gold/Nickel | 12 Months |