The specifications listed below represent the standard capabilities of Additive Circuits. Other constructions, configurations and technologies may be available.
For further details on requirements, please contact us or view our ‘Manufacturing Capabilities’ PDF File.
Gerber | |
Gerber 274X | |
ODB ++ |
Balanced | |
Controlled Impedance | |
Minimum Thickness : 0.008" | |
Maximum Thickness : 0.236'' | |
Layer count up to 30 |
Per IPC 4101 | |
Per IPC-CF-150 | |
Standard FR4 | |
FR4 170°C Tg | |
Polyimide | |
BT Epoxy | |
Nelco 4000 Series | |
Roger 4000 Series | |
Minimum Cladding : ½ oz | |
Maximum Cladding : 4 oz | |
Minimum Core : 0.003" |
Hot Air Solder Level | |
Electroless Ni/Immersion Gold | |
Full Body Nickel/Gold | |
Selective Hard Gold | |
Organic Solderability Preservative | |
Carbon Ink |
Single-Up & Panel Form | |
Beveling | |
Countersink & Counter Bore | |
Edge Milling | |
Vcut/Scoring | |
Hole Plugging | |
Conductive / Non Conductive Paste |
24 Hour Delivery | |
Vacuum Seal Package (Overseas) |
ISO 9001:2015 | |
ISO 14001:2015 | |
ISO 45001:2018 | |
IPC 6012 Class 2 minimum | |
UL 94V-0 | |
ROHS | |
NSRS - Level 3 to perform PCB fabrication |
Minimum Circuit Board Size: 1" x 1" | |
Maximum Board Sizes: | |
Standard : 24" x 28" | |
Engineering : 23" x 31" |
Standard : 0.0035" | |
Engineering : 0.003" |
Minimum Drilled Hole Size: | |
Standard : 0.20 mm | |
Engineering : 0.15 mm | |
Tolerance for PTH: | |
Standard : ± 3mils | |
Engineering : ± 2mils | |
Aspect Ratio Value for Drill vs Thickness: | |
Standard : 15 : 1 | |
Engineering : 25 : 1 | |
DMSE Process |
Per IPC-SM-840 | |
Liquid Photoimageable | |
Epoxy Via Plugging | |
S/M Colours Available : Green, Red, Blue, Yellow, Black | |
Legend Ink Available : White, Black, Yellow |
Thermal Stress X-Sectioning | |
Spectrophotometer Analysis | |
Hull Cell |
Surface Mount | |
BGA & Micro BGA | |
Burn-In Boards |