CAPABILITIES

Our Capabilities

The specifications listed below represent the standard capabilities of Additive Circuits. Other constructions, configurations and technologies may be available.

 

For further details on requirements, please contact us or view our ‘Manufacturing Capabilities’ PDF File.

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Acceptable Media Formats
Gerber
Gerber 274X
ODB ++
Construction
Balanced
Controlled Impedance
Minimum Thickness     : 0.008"
Maximum Thickness     : 0.236''
Layer count up to 30
Laminates & Materials
Per IPC 4101
Per IPC-CF-150
Standard FR4
FR4 170°C Tg
Polyimide
BT Epoxy
Nelco 4000 Series
Roger 4000 Series
Minimum Cladding     : ½ oz
Maximum Cladding     : 4 oz
Minimum Core     : 0.003"
Types of Finishes
Hot Air Solder Level
Electroless Ni/Immersion Gold
Full Body Nickel/Gold
Selective Hard Gold
Organic Solderability Preservative
Carbon Ink
Fabrication
Single-Up & Panel Form
Beveling
Countersink & Counter Bore
Edge Milling
Vcut/Scoring
Hole Plugging
Conductive / Non Conductive Paste
Packing & Shipping
24 Hour Delivery
Vacuum Seal Package (Overseas)
Industry Standards
ISO 9001:2015
ISO 14001:2015
ISO 45001:2018
IPC 6012 Class 2 minimum
UL 94V-0
ROHS
NSRS - Level 3 to perform PCB fabrication
Panel Sizes
Minimum Circuit Board Size: 1" x 1"
Maximum Board Sizes:
Standard : 24" x 28"
Engineering : 23" x 31"
Trace & Space
Standard : 0.0035"
Engineering : 0.003"
Drilling
Minimum Drilled Hole Size:
Standard : 0.20 mm
Engineering : 0.15 mm
Tolerance for PTH:
Standard : ± 3mils
Engineering : ± 2mils
Aspect Ratio Value for Drill vs Thickness:
Standard : 15 : 1
Engineering : 25 : 1
DMSE Process
Solder Mask & Legend Ink
Per IPC-SM-840
Liquid Photoimageable
Epoxy Via Plugging
S/M Colours Available : Green, Red, Blue, Yellow, Black
Legend Ink Available : White, Black, Yellow
Laboratory
Thermal Stress X-Sectioning
Spectrophotometer Analysis
Hull Cell
Product Types
Surface Mount
BGA & Micro BGA
Burn-In Boards
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